Conveyorized electroplating device

ABSTRACT

A conveyorized electroplating device having an anode positioned proximate to a plurality of absorptive applicator assemblies that apply a plating solution to a substrate and a conveyor device that grips the substrate thereby isolating the electrical contact from the plating solution. The conveyorized electroplating device has a fluid bed assembly with a manifold and an anode, a conveyor device adjacent to the fluid bed assembly, and a plurality of absorptive applicator assemblies, wherein the plurality of absorptive applicator assemblies are adjacent and in close proximity to the anode and in fluid communication with the fluid bed assembly. The conveyor device isolates the electrical contacts from the plating solution and is able to handle various sizes and thicknesses of substrates. The conveyor device of the present invention comprises a drive assembly and a gripper assembly connected thereto, wherein the gripper assembly has a non-metallic housing, a metallic member slideably mounted within a cavity defined by the non-metallic housing, an arm pivotably mounted to the housing and forming a passageway, and a seal mounted adjacent to the arm.

CROSS REFERENCE TO RELATED APPLICATIONS

Not Applicable.

STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT

Not Applicable.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention generally relates to apparatus and methods forconveying and electroplating a substrate. More particularly, the presentinvention is generally directed to a conveyorized electroplating devicehaving an anode positioned proximate to a plurality of absorptiveapplicator assemblies that apply a plating solution to the substrate anda conveyor device that grips the substrate thereby isolating theelectrical contact from the plating solution.

2. Description of the Invention Background

Many conventional electroplating devices typically employ mechanisms formoving substrates through a series of large baths or large tankscontaining a plating solution. One of the disadvantages of this type ofelectroplating device is the lengthy amount of time to complete theelectroplating process. For example, electroplating one (1) mil ofcopper in holes contained within a substrate may take in excess of one(1) hour. Another disadvantage of this type of conventionalelectroplating device is the relatively low exchange of metallic ions atthe substrate surface due to the limitations of the bath circulation andthe off contact nature of the anode/cathode positions.

Some conventional horizontal electroplating conveyor systems thatdeliver electrical power to the substrate include a driven roller typeconveyor system and a non-driven roller type conveyer system. The drivenroller type conveyor system includes solid or disk type rollers toconvey the substrate through the plating area. The non-driven rollersystem grips the substrate at its edges by spring loaded contacts andpulls the substrate through the plating area. Both of these systemssuffer from the problem of exposing electrified metallic surfaces toplating solution which necessitates the removal of the resultingundesired plating from the roller assemblies thus, preventing them fromacting as reliable and dimensionally stable electrical contacts so thatcurrent can be delivered to the substrate.

Thus, the need exists for a conveyorized electroplating device that canelectroplate a substrate in a relatively short time while providing ahigh exchange of metallic ions at the substrate surface resulting in asubstrate that has a uniform electroplated surface.

The need also exists for a conveyorized electroplating device thatminimizes the need to recondition the electrical contacts that areexposed to plating solution thus, assuring a more reliable andrepeatable contact point and a more stable process.

Yet another need exists for a conveyorized electroplating device thathas the ability to handle substrates of various sizes and thicknesswithout the need for mechanical adjustment.

SUMMARY OF THE PRESENT INVENTION

One form of the present invention provides a conveyorized electroplatingdevice that electroplates a substrate in a relatively short time andexhibits a relatively high exchange of metallic ions at the substrateresulting in a uniform electroplated surface.

The present invention may also include a conveyorized electroplatingdevice comprising a fluid bed assembly having a manifold and an anode, aconveyor device adjacent to the fluid bed assembly, and a plurality ofabsorptive applicator assemblies wherein the plurality of absorptiveapplicator assemblies are adjacent and in close proximity to the anodeand in fluid communication with the fluid bed assembly.

The present invention may also include a fluid bed assembly having aplurality of baffles received within the manifold such that the platingsolution will flow uniformly from the fluid bed assembly.

The present invention may comprise a conveyorized electroplating devicethat includes a plurality of absorptive applicator assemblies, aconveyor device and an anode, wherein each of the plurality ofabsorptive applicator assemblies has a profile and defines a fluidpassageway that delivers plating solution thereto, and wherein the anodehas a profile that corresponds to the profiles of the absorptiveapplicator assemblies.

Another embodiment of the present invention provides for a conveyordevice that isolates the electrical contacts from the plating solutionand that is able to handle various sizes and thicknesses of substrates.The conveyor device of the present invention may include a driveassembly and a gripper assembly connected thereto, wherein the gripperassembly has a non-metallic housing, a metallic member slideably mountedwithin a cavity defined by the non-metallic housing, an arm pivotablymounted to the housing and forming a passageway, and a seal mountedadjacent to the arm.

The present invention further provides for a modular conveyorizedelectroplating device, wherein multiple modular conveyorizedelectroplating devices are used together depending on the specific needsof the application. Furthermore, the modular conveyorized electroplatingdevice makes it easy for the user to maintain and replace one or more ofthe modular conveyorized electroplating devices.

The present invention may also comprise a method of conveying andelectroplating a substrate, comprising gripping the substrate at theedges thereof, electrifying the substrate, moving the substrate on orbetween a plurality of absorptive applicator assemblies, pumping aplating solution in contact with the absorptive applicator assembliesand onto the substrate, and isolating the electrical contact at thesubstrate from the plating solution.

Other details, objects and advantages of the present invention willbecome more apparent with the following description of the presentinvention.

BRIEF DESCRIPTION OF THE DRAWINGS

For the present invention to be readily understood and practiced,various embodiments will be described in conjunction with the followingfigures wherein:

FIG. 1 is a perspective view of the conveyorized electroplating deviceof the present invention wherein several modules are placed end to endto create the desire length of the electroplating process;

FIG. 2 is a perspective view of one of the modules of the conveyorizedelectroplating device of the present invention, wherein a portion of thehousing has been removed;

FIG. 3 is a perspective view of one of the modules of the conveyorizedelectroplating device of the present invention, wherein the entirehousing has been removed;

FIG. 4 is an exploded view of a fluid bed assembly of the conveyorizedelectroplating device of the present invention shown in FIG. 3;

FIG. 5 is a cross-sectional view of a fluid bed assembly of the presentinvention shown in FIG. 4 and taken along line 5—5;

FIG. 6 is a perspective view of a drive assembly of the conveyorizedelectroplating device of the present invention shown in FIG. 3;

FIG. 7 is a perspective view of a gripper assembly of the conveyorizedelectroplating device of the present invention shown in FIG. 3;

FIG. 8 is a front view of the gripper assembly shown in FIG. 7;

FIG. 9 is a top view of the gripper assembly shown in FIG. 7;

FIG. 10A is a sectional view of the gripper assembly shown in FIG. 8 andtaken along line 10—10, wherein the extension is in the unengagedposition and no substrate is being gripped;

FIG. 10B is another sectional view of the gripper assembly, wherein theextension is in the intermediate position and a substrate is beinggripped;

FIG. 10C is another sectional view of the gripper assembly, wherein theextension is in the fully engaged position and a substrate is beinggripped;

FIG. 10D is another sectional view of the gripper assembly, wherein theextension is in the intermediate position and no substrate is beinggripped;

FIG. 11 is a perspective view of an upper roller assembly of theconveyorized electroplating device of the present invention shown inFIG. 3;

FIG. 12 is a right side view of the upper roller assembly shown in FIG.11;

FIG. 13 is a longitudinal sectional view of the upper roller assemblyshown in FIG. 12 and taken along line 13—13;

FIG. 14 is a perspective view of the lower roller assembly of theconveyorized electroplating device shown in FIG. 3;

FIG. 15 is a right side view of the lower roller assembly shown in FIG.14;

FIG. 16 is a longitudinal sectional view of the lower roller assemblyshown in FIG. 15 and taken along line 16—16;

FIG. 17 is a diagrammatical top view of the drive assembly and gripperassemblies of the conveyorized electroplating device of the presentinvention shown in FIG. 3;

FIG. 18 is a diagrammatical multiple layer sectional view of theconveyorized electroplating device of the present invention shown inFIG. 3;

FIG. 19A is a diagrammatical sectional view of the drive assembly andgripper assemblies of the present invention shown in FIG. 17 and takenalong line 19—19;

FIG. 19B is a diagrammatical sectional view of another embodiment of thedrive assembly and gripper assembly of the present invention having acleaning device;

FIG. 20 is a sectional view of the gripper assemblies illustrating themovement of the gripper assemblies during the process of plating thesubstrate and also illustrating an alternative embodiment of the firstcontact;

FIG. 21 is an exploded perspective view of another embodiment of theconveyorized electroplating device of the present invention;

FIG. 22 is another exploded perspective view of the conveyorizedelectroplating device of the present invention shown in FIG. 21, whereinthe absorptive applicator assemblies have been removed;

FIG. 23 is an exploded view of the fluid bed assembly of theconveyorized electroplating device of the present invention shown inFIG. 21;

FIG. 24 is a sectional view of another embodiment of the coveyorizedelectroplating device of the present invention having absorptiveapplicator assemblies;

FIG. 25 is a perspective view of yet another embodiment of theconveyorized electroplating device of the present invention;

FIG. 26 is a sectional view of the conveyorized electroplating deviceshown in FIG. 25;

FIG. 27 is a top view of the conveyorized electroplating device shown inFIG. 25;

FIG. 28 is a perspective view of another embodiment of the conveyorizedelectroplating device of the present invention;

FIG. 29 is a sectional view of the conveyorized electroplating device ofthe present invention shown in FIG. 28;

FIG. 30 is a top view of the conveyorized electroplating device of thepresent invention shown in FIG. 28;

FIG. 31 is a perspective view of yet another embodiment of theconveyorized electroplating device of the present invention;

FIG. 32 is a sectional view of the conveyorized electroplating device ofthe present invention shown in FIG. 31;

FIG. 33 is a top view of the conveyorized electroplating device of thepresent invention shown in FIG. 31;

FIG. 34 is a perspective view of yet another embodiment of theconveyorized electroplating device of the present invention;

FIG. 35 is a sectional view of the conveyorized electroplating device ofthe present invention shown in FIG. 34;

FIG. 36 is a top view of the conveyorized electroplating device of thepresent invention shown in FIG. 34;

FIG. 37 is an enlarged view of the conveyorized electroplating device ofthe present invention shown in FIG. 34 illustrating the anode and theabsorptive applicator assemblies;

FIG. 38 is a side view of one of the absorptive applicator assemblies ofthe conveyorized electroplating device of the present invention shown inFIG. 34;

FIG. 39 is a sectional view of the absorptive applicator assembly shownin FIG. 38;

FIG. 40 is side view of another embodiment of the absorptive applicatorassemblies of the conveyorized electroplating device of the presentinvention;

FIG. 41 is a sectional view of the shaft of the absorptive applicatorassembly shown in FIG. 40;

FIG. 42 is a side view of yet another embodiment of one of theabsorptive applicator assemblies of the conveyorized electroplatingdevice of the present invention; and

FIG. 43 is an enlarged sectional view of the absorptive applicatorassembly shown in FIG. 42.

DETAILED DESCRIPTION OF THE INVENTION

The present invention will be described below in terms of apparatusesand methods for electroplating and conveying a circuit board. It shouldbe noted that describing the present invention in terms ofelectroplating and conveying a circuit board is for illustrativepurposes and the advantages of the present invention may be realizedusing other structures and technologies that have a need for anapparatus and a method for electroplating and/or conveying a substrate.

It is to be further understood that the Figures and descriptions of thepresent invention have been simplified to illustrate elements that arerelevant for a clear understanding of the present invention, whileeliminating, for purposes of clarity, other elements and/or descriptionsthereof found in a typical conveyorized electroplating device. Those ofordinary skill in the art will recognize that other elements may bedesirable in order to implement the present invention. However, becausesuch elements are well known in the art, and because they do notfacilitate a better understanding of the present invention, a discussionof such elements is not provided herein.

FIG. 1 is a perspective view of the modular conveyorized electroplatingdevice 100 of the present invention, wherein several modules 102 can beplaced end to end to create the desire length of the electroplatingprocess. Although the illustrated modular conveyorized electroplatingdevice system 100 of FIG. 1 comprises three modules, any number ofmodules 102 can be placed end to end. The modular conveyorizedelectroplating device system 100 has an input station 104 and an outputstation 106 such that a circuit board substrate (not shown) is loadedinto the modular conveyorized electroplating device system 100 at theinput station 104 and exits at the output station 106 after beingelectroplated. The housing 108 of the modular conveyorizedelectroplating device system 100 may have several removable panels suchthat the internal mechanisms of the modular conveyorized electroplatingdevice 110 can be easily accessed for maintenance.

FIG. 2 is a perspective view of one of the modules 102 of the modularconveyorized electroplating device system 100 of the present invention,wherein part of the housing 108 has been removed for clarity. The modulemay include an input section 103 and an output section 105 if usedalone. The modular configuration of the conveyorized electroplatingdevice system 100 allows for the fluid bed assembly 112, the conveyordevice 114 and the absorptive applicator assemblies 116 to be easilyremoved from the module 102 for maintenance and replacement thereof Eachof the modules 102 of the conveyorized electroplating device system 100comprises one or more fluid bed assemblies 112, a conveyor device 114and absorptive applicator assemblies 116, each of which are discussed ingreater detail below.

FIG. 3 is a perspective view of a single conveyorized electroplatingdevice 110 of the present invention, wherein the housing 108 has beencompletely removed for clarity. The fluid bed assembly 112 extendsacross and above some of the absorptive applicator assemblies 116. Oneof the longitudinal edges of the fluid bed assembly 112 is parallel andadjacent to the longitudinal axis of the conveyor device 114. Theabsorptive applicator assemblies 116 comprise upper roller assemblies118 and corresponding lower roller assemblies 120. The lower rollerassemblies 120 define a track 119 for the circuit board substrate totravel thereon. The upper and lower roller assemblies 118 and 120 arerotatably supported at their ends by bearing blocks 121. Thelongitudinal edge of the conveyor device 114 is adjacent and parallel tothe longitudinal edge of the absorptive applicators assemblies 116. Theconveyor device 114 also includes a drive assembly 150 and a gripperassembly 124.

FIGS. 4 and 5 illustrate a fluid bed assembly 112 of the conveyorizedelectroplating device 110 shown in FIG. 3. The fluid bed assembly 112comprises a manifold 130, a plurality of baffles 132 and an anode 134.In this embodiment, the manifold 130 is substantially rectangular anddefines several receptacle portions 135 each having an inlet 136 and aplurality of stand offs that take the form of rod members 138. Theinlets 136 are in fluid communication with a plating solution reservoir111, as shown in FIG. 3. The plating solution is pumped to the inlets136 through conduit 101 by pump 109, as shown in FIG. 3. Each of the rodmembers 138 define a recess (not numbered) for supporting the pluralityof baffles 132. The shelf 144 extends inwardly from the vertical wallsof the manifold 130 and around the periphery of each of the receptacleportions 135. The shelf 144 acts to redirect the plating solution sothat the plating solution exits the anode holes 148 uniformly. Othertypes of mechanisms that may be used to redirect the plating solutionare diffuser cones. The manifold 130 further has a plurality of mountingclaws 140 defining holes (not numbered) for mounting the manifold 130securely onto the housing 108 using any conventional fasteners such asscrews. The manifold 130 also has a seal 142 around its periphery at 141where it is connected to holes 359 located around the periphery of theanode 134 with suitable fasteners such as stainless steel, titanium orplastic screws or a clamping system. The manifold 130 may be made ofpolyvinylchloride as well as a variety of other materials which will beapparent to one of ordinary skill in the art. The seal 142 may be a hardrubber gasket, a silicone sealer or any other material that iscompatible with the fluid bed assembly 112.

The baffles 132 are substantially rectangular members having severalpins 145 extending from the top surface of the baffles 132 and defininga second recess (not numbered) for receiving fasteners 143 extendingthrough holes 361 located within the periphery of the anode 134 thus,attaching the anode 134 to the baffles 132. Thus, the baffles 132 arereceived within the manifold receptacles 135 and are supported by therod members 138 and are connected to the rod members 138 by fasteners146 such as stainless steel screws. The baffles 132 may be made frompolyvinylchloride as well as a variety of other materials, which will beapparent to one of ordinary skill in the art. Although not illustrated,the shape of the baffles 132 may take a variety of configurations thatwill be apparent to one of ordinary skill in the art. Also theconveyorized electroplating device of the present invention may be madewithout baffles 132, as will be described below.

The anode 134 is a planar member having a substantially rectangularshape and a defining plurality of holes 359 and 361 extending throughthe anode 134. As stated above, fasteners 143 such as stainless steelscrews extend through the holes 361 and connect to the pins 145. SeeFIG. 5. The anode 134 is further supported by the manifold 130 in thatthe anode 134 rests on the manifold's periphery at 141 and is attachedby stainless steel screws being received in holes 359. The anode 134further comprises slots 148 through which the plating solution passes.The fluid bed assembly 112 attaches to the housing 108 at its mountingclaws 140. The fluid bed assembly 112 is positioned such that the anode134 is in sufficiently close proximity to the absorptive applicatorassemblies 116 (FIG. 3) in order to provide a relatively high metallicion exchange between the anode 134 and the substrate 217. The anode 134may be titanium, copper, tin, a precious metal, or an inert metaldepending on the application.

FIG. 6 is a perspective view of a drive assembly 150 of the conveyorizedelectroplating device 110 shown in FIG. 3, which illustrates part of theconveyor device 114 of the present invention. The drive assembly 150comprises an actuator in the form of a chain 152 with mountingattachments 154 connected thereto, a drive frame 156, a drive mechanism158, a driven mechanism 160, a chain tension block 162, chain guides 164and an actuator drive 126. The chain 152 moves along the length of thedrive frame 156 and around the drive mechanism 158 and driven mechanism160. Mounting attachments 154 attached to the chain 152 aresubstantially planar members that are rigid and have a somewhat squareshape with rounded edges. The drive frame 156 is fixedly attached to thehousing 108 by any conventional fastening method. The drive mechanism158 and the driven mechanism 160 are rotatable. The driven mechanism 160is rotated by the actuator drive 126 which results in the movement ofthe chain 152. The chain tension block 162 allows for the tightening orloosening of the chain 152 (i.e., decreasing or increasing the slack inthe chain). The chain guides 164 provide that the chain 152 move in asubstantially straight path along the length of the drive frame 156. Theactuator drive 126 comprises a drive motor 122 and gear box. The driveassembly may alternatively comprise pneumatics, electrical and hydrauliccomponents.

FIGS. 7-10 illustrate one of the gripper assemblies 124 of theconveyorized electroplating device 110 of the present invention shown inFIG. 3. The gripper assembly 124 comprises a non-metallic housing 166, ametallic member 168, a pivotable panel support 172 which takes the formof an arm, and a seal 176. The non-metallic housing 166 comprises aT-shaped member 178 and a second member 180 (FIGS. 7 and 8). TheT-shaped member 178 has a trunk 182 and two branches 184 extendingsubstantially perpendicular from the trunk 182. The trunk 182 is asubstantially elongated rectangular member and has a cavity 186 therein(FIG. 10). The cavity 186 slidably receives the metallic member 168. Thesecond member 180 of the housing 180 also defines a passage 170 whichreceives the trunk 182 of the T-shaped member 178. The second member 180further defines a mounting portion 190 having a plurality of holes 192,shown in hidden lines in FIGS. 10A-10D. The mounting portion 190 isconnected to the mounting attachments 154 by stainless steel screws orother appropriate fasteners. A housing biasing member 194 extendsbetween each branch 184 of the T-shaped member 178 and the second member180 of the housing 166 (FIG. 8) and are received within cavities 185(shown in hidden lines) of the second member 180 of the housing 166. Thehousing 166 may be made of a variety of non-metallic materials such aspolypropylene or polyethylene as well as any other non-metallicmaterials that are compatible with plating solution and the operatingtemperature of the electroplating device of the present invention thatwill be apparent to one of ordinary skill in the art. The housingbiasing members 194 may be coil springs; however, other biasing memberscan also be used as will be apparent to one of ordinary skill in theart.

Referring to FIGS. 10A through 10D, the metallic member 168 comprises afirst contact 197, a second contact 199, a first biasing member 200, asecond biasing member 202, flexible contact wire 204 and a roller 206.The contact wire 204 may also take the form of a braided ormulti-stranded wire. The first contact 197 is a substantially elongatedrectangular member having the roller 206 rotatably connected thereto bya set screw 208 such that the set screw 208 transverses the longitudinalaxis of the first contact 197. The first contact 197 also defines anopening 198. The second contact 199 is a substantially elongatedrectangular member, defining an opening 210 therein, and having anextension 212 extending therefrom and through an opening 214 in theT-shaped member. The first biasing member 200 is between the first andsecond contacts 197 and 199. The contact wire 204 is connected to andextends between the first contact 197 and the second contact 199. Thecontact wire 204 is attached to the first and second contacts 197 and199 by set screws 218. The second biasing member 202 is positioned atthe base of the cavity 186. The first and second biasing members 200 and202 may be coil springs; however, a variety of other biasing members canbe used which will be apparent to one of ordinary skill in the art. Thefirst and second biasing members 200 and 202 have a greater stiffnessthan the stiffness of the housing biasing members 194. The first andsecond contacts 197 and 199, the first and second biasing members 200and 202, contact wire 204 and the roller 206, may be made form a varietyof metallic materials such that electrical current will be easilyconducted therethrough.

The pivotable panel support 172 is a substantially L-shaped arm memberhaving one leg thereof pivotally connected to the housing 166 by a pin213 and the other leg of the L-shaped member free to swing in an arc andthus form a passageway 174 with the housing 166.

The seal 176 is attached to the exterior of the trunk 178 and adjacentthe pivotable panel support 172 by any conventional fasteners such asadhesive, pins, or clips. The seal 176 is a conical compressive sealfabricated from, for example, EDPM such that after the seal 176 iscompressed (FIGS: 10B, 10C and 10D), the seal 176 will spring back toits original form (FIG. 10A). The length of the free leg of thepivotable panel support 172 is sized such that when the pivotable panelsupport 172 is pivoted about pin 213 toward the seal 176, the seal 176forms a fluid tight seal therewith (FIG. 10D).

The absorptive applicator assemblies 116 take the form of upper rollerassemblies 233 and lower roller assemblies 253. FIGS. 11-13 illustratean upper roller assembly 233. Each of the upper roller assemblies 233may comprise a solid shaft 235 or hollow shaft (not shown) that has aroll bushing 237 pressed thereon at each of its end portions 240.Another shaft bushing 246 is pressed onto the intermediate portion 242of the shaft 235. As can be seen in FIG. 13, bushings 237 and 246 arereceived within a liner 245 that is pressed into an elongated roller247. It will be appreciated that bushings 237 and 246 rotatably supportsolid shaft 235 within liner 245. An upper roller assembly 233 furthercomprises a bushing 250 pressed onto the shaft 235 at one of the endportions 240. A flange member 239 is pressed onto the other end of thesolid shaft 235 and extends perpendicular thereto. The flange member 239further includes a projection 251 which is supported by the bearingblocks 121 and prevents the solid shaft 235 from rotating. The shaft 235and the bushings 237, 246 and 250 are rotatably received within theroller 247 and the liner 245 such that the roller 247 can rotaterelative to the shaft 235. The elongated roller 247 may be made of awoven mesh made from polypropylene, polyethylene or polyvinyl alcohol;however, a variety of materials can be used for the roller 247 as willbe apparent to one of ordinary skill in the art. The shaft 235 may bemade of polyvinylchloride; however, it will be apparent to one ofordinary skill that other materials may be used as well. Bushings 237,246 and 250 may be made of polypropylene; however, any material havingsuitable mechanical and chemical properties could also be used for thebushings 237, 246 and 250. The shaft 235 is supported at its endportions 240 to the bearing block 121 wherein the solid shaft 235 andthe flange member 239 are received within recesses of the bearing blocks121, shown in FIG. 3.

FIGS. 14-16 illustrate a lower roller assembly 253 of the conveyorizedelectroplating device 110 shown in FIG. 3. A lower roller assembly 253may include a solid shaft 255, two roll bushings 261, a shaft bushing263, a sprocket 265, a liner 267, and a roller 269. The solid shaft 255has two end portions 257 and an intermediate portion 259. The rollbushings 261 are pressed onto the two end portions 257 of the shaft 255.Similarly, the shaft bushing 263 is pressed onto the intermediateportion 259. The sprocket 265 is pressed onto one end portion 257. Aliner 267 is pressed into a coaxial passage in roller 269 and isrotatably supported on the bushings 263 and 261. The roller 269 may bemade from woven mesh of polypropylene, polyethylene or polyvinyl alcoholor a variety of other materials apparent to one of ordinary skill in theart. The shaft 255, the liner 267, and the bushings 263 and 261 also maybe made of the materials for the like parts stated above. The endportions 257 of the shaft 255 are received within recesses in thebearing block 121 (FIG. 3) and the sprocket 265 is engaged and rotatedby a chain (not shown) to drive lower roller assemblies 253. However,other conventional drive mechanisms can be used to drive the lowerroller assemblies 253. The chain is driven by a lower roller driveassembly 128. The lower roller drive assembly 128 may be a DC motor, anAC motor, a stepper motor or a servo motor.

FIG. 17 is a top view of a drive assembly 150 and gripper assemblies124. FIG. 18 is a multiple layer longitudinal sectional view of thedrive assembly 150 and gripper assemblies 124 shown in FIG. 17. FIG. 19Ais a horizontal sectional view of the drive assembly 150 and gripperassemblies 124 of the present invention shown in FIG. 17 and taken alongline 19—19 in FIG. 17. FIG. 20 is a sectional view of the gripperassemblies 124 illustrating the movement of the gripper assemblies 124when the substrate 217 is being fed through the conveyorizedelectroplating device 110. In FIGS. 18, 19A and 20, the gripperassemblies 124 are illustrated as a simplified form for clarity. Inoperation, a circuit board substrate 217 is inserted into theconveyorized device 110 at the input station 104 (shown in FIG. 1), fedonto the track 119 of one of the modules 102 (shown in FIG. 3) and isgripped along the length of one of its edges 219 by the gripper assembly124 (FIGS. 17, 18, 19A and 20). As shown in FIG. 17, as the gripperassemblies 124 a round the corner of the drive assembly 150, thesubstrate 217 is gripped by the gripper assembly 124 a and is carried indirection A due to the motion of the chain 152. As the gripper assembly124 a is about to turn at the opposing end of the drive frame 156following the path of the chain 152, the gripper assembly 124 a willrelease the substrate 217 having carried the substrate 217 the length ofthe drive frame 156.

Referring to FIGS. 18 and 20, for the pivotable panel support 172 of thegripper assembly to grasp the circuit board substrate 217, the roller206 engages a ramp 223 which is inclined in the downward direction B(FIG. 20). The ramp 223 is a bus bar 221. As the gripper assembly 124moves further in the direction A, the ramp 223 forces the roller 206 indirection B, which results in the T-shaped member 178 exerting a forceon the housing biasing members 194 and being compressed in a direction B(see FIGS. 8, 10B, 10C and 10D). FIG. 10A illustrates the gripperassembly 124 before it engages the ramp 223. When the gripper assemblyengages ramp 223 and even before a substrate 217 enters passageway 174the seal 176 engages the arm member 172. (FIG. 10D). The housing biasingmembers 194 will compress before the first and second biasing members200 and 202 because the housing biasing members 194 are weaker. As theramp 223 (FIG. 20) further increases in a downward direction B, theforce exerted on the roller 206 (FIGS. 8, 10B, 10C and 10D) compressesthe first and second biasing members 200 and 202, resulting in theextension 212 moving from an unengaged position without a substrate 217(FIG. 10D), to an intermediate position (FIG. 10B) to a fully engagedposition (10C), wherein the extension 212 extends from opening 214 andmakes contact with the substrate 217 which is received within passageway174 (FIG. 10C). Because the housing springs 194 are less stiff than thefirst and second biasing member 200 and 202, the T-shaped member 178will be compressed in direction B initially. Having the two differentstrength springs allows for the T-shaped member 178 to move in directionB resulting in the seal 176, engaging the arm member 172 and theextension member 212 to remain within cavity 186 and thus, be protectedfrom the plating solution until the substrate 217 is received withinpassageway 174 at which time the substrate 217 will engage the seal 176(FIG. 10C) and thus isolate extension 212 from the plating solution. Theextension 212 is in the unengaged position (FIG. 10A) when no force hasbeen applied to the housing biasing members 194 on the first and secondbiasing members 200 and 202. The extension is an unengaged positionwithout a substrate when the roller engages the ramp 223 but nosubstrate 217 is present in the passageway 174 (FIG. 10D). The extension212 is in the intermediate position (FIG. 10B), when the housing biasingmembers 194 are being compressed. The extension is in the engagedposition when it is extending from the opening 214 (FIG. 10C).

At the same time that rollers 206 of the gripper assemblies 124 areengaging the ramp 223, the pivotable panel support 172 is riding acrossledge 225 such that the ledge 225 supports the pivotable panel support172 in the C direction. See FIG. 20. Furthermore, when the rollercontacts the ramp 223, which is a bus bar 221, electricity is suppliedto the roller 206. The electricity flows through the metallic roller206, through the first contact 197, through the contact wire 204,through the second contact 199 and through the extension 212. When theextension 212 contacts the substrate 217, the substrate is thenelectrified. While the gripper assemblies are gripping the substrate,moving it in direction A and electrifying the substrate, the platingsolution is being pumped through the fluid bed assembly 112 from platingreservoir 111 (FIGS. 3-5). The plating solution enters inlet 136 and isdiffused by the baffles 132 and forced through the electrified anodeslots 148 where it then is applied to the upper roller assemblies 233which are in contact with the substrate 217 and is transferred therebyto the substrate 217 which is in contact with the upper rollerassemblies 233. Both a DC current electroplating method may be used toplate the substrate or a pulse plating method may be used. One exampleof a pulse plating system that may be used is manufactured by ChemringPlating Systems of Kennett Square, Pa. 19348. The baffles 132 forces theplating solution to be evenly distributed along the anode 134 andexiting the anode evenly along the surface thereof. Without the baffles132, the plating solution would enter the inlet 136 and move directly tothe closest holes 148 thus exiting the anode 134 at concentrated areas.

FIG. 19B is a diagrammatical sectional view of another embodiment of thedrive assembly and gripper assembly having a cleaning device 350 for theextension 212, which is the electrical contact. The cleaning device 350comprises an abrasive disk 356, a motor 352 and a spring loaded verticalactuator 354. The abrasive disk 356 can be substantially comprised of adiamond dust mounted on a structure; however, many other abrasivesurfaces may be used. The motor 352 may be an electrical motor, apneumatic motor or other types of motors apparent to one of ordinaryskill in the art. The spring loaded vertical actuator 354 may be a coilspring or other members that will absorb the downward force of thedevice 350. The cleaning device is mounted on the return pass of thedrive assembly 150. As the gripper assembly 124 rides along the ramp358, the extension 212 is forced passed the seal 176 while at the sametime the abrasive disk 356 is moved into contact in the direction F withthe extension 212 by the spring loaded vertical actuator 354. Thiscontact results in the removal of unwanted plating or oxidation from theextension 212.

This embodiment of the present invention places a relatively largeamount of absorptive applicator assemblies 116 in contact with thesubstrate 217 and both the assemblies 116 and the substrate 217 in closeproximity with the anode 134 which results in a high metallic ionexchange. Furthermore, the relatively large number of assemblies 116 incontact with the substrate provides for the desired plating of holesand/or openings in the substrate 217.

As can be seen in FIG. 20, a ski-shaped device 227 can be substitutedfor the roller 206. The ski-shaped device 227 can be made of a varietyof metallic materials such as copper.

FIGS. 21-23 illustrate another embodiment of the conveyorizedelectroplating device 110 of the present invention. The conveyorizedelectroplating device system 100 comprises two fluid bed assemblies 112,a lower anode assembly dam 277, upper and lower bearing block supports121, absorptive applicator assemblies 116, and portions of housing 108.The conveyor device 114 previously discussed is also used in thisembodiment; however, it has been omitted from FIGS. 21-23 for claritypurposes. The fluid bed assembly 112 shown in FIG. 23 comprises amanifold 130 and an anode 134. The manifold 130 is a substantiallyrectangular member having an inlet 271, a receptacle portion 131 and amounting flange 273 on opposing sides of the manifold 130. The anode 134consists of a substantially rectangular planar member fabricated from amaterial suitable for the material of the substrate having holes 148extending therethorough. For example, if the substrate is to be platedwith copper, the anode 134 may be copper and the plating solution may bea copper acid bath. Also the anode may be, for example, titanium ortitanium with a coating. Furthermore, the anode 134 may benon-sacrificial and inert such as titanium or titanium with a coatingand the plating solution may be a tin bath. However, one of ordinaryskill will appreciate that a variety of anodes and plating solutions maybe used. The anode 134 is connected to the manifold 130 at its peripheryby stainless steel screws 275 and the fluid bed assembly 112 is thenconnected to the housing (not shown).

The lower anode assembly dam 277, shown in FIG. 21, comprises fourvertical walls forming a rectangular shape, wherein the opposing sidewalls define recesses 279. The shafts 235 and 257 of the upper and lowerroller assemblies 233 and 253 are received with the recesses 279. Thelower anode assembly dam 277 also has a cut-out portion 281 at one endthereof that receives the tubular inlet member 271 of the manifold 130.The lower anode assembly dam 277 is supported by the fluid bed assembly112 and connected to the anode 134 by fasteners (not shown). Thevertical walls are notched to be received within the upper and lowerbearing block supports 121. See FIG. 22.

The upper and lower roller assemblies 233 and 253, shown in greaterdetail in FIGS. 11-16 and described above, are rotatably received withinupper and lower bearing blocks supports 121. The upper bearing blocks121 have recesses 283 that rotatably receive a corresponding shaft 235and flange member 239 of the upper roller assemblies 233. Similarly, thelower bearing blocks 121 have recesses 183 that are adapted to receivecorresponding shaft 235 and flange member 239 of a corresponding lowerroller assembly 253. The lower and upper bearing block supports 121 arerigidly connected to the housing 108 by any conventional fasteners,including screws, bolts, rivets, etc. In operation, plating solutionenters the fluid bed assembly 112 through inlet 271 of the manifold 130and exits the fluid bed assembly 112 through the anode holes 148 and isapplied to the roller assemblies 233 and 253 of the absorptiveapplicator assemblies 116, wherein the plating solution will betransferred to both sides of the substrate as it moves over theabsorptive applicator assemblies 116. The lower anode assembly dam 277prevents the plating solution from spilling over the sides of the fluidbed assembly 112 as it exits the anode holes 148 thus, redirecting thesolution onto the absorptive applicator assemblies 116. The lower anodeassembly dam 277 creates a reservoir for the plating solution thus,keeping the roller assemblies 116 wet with the plating solution. Thisresults in the substrate 217 also remaining wet with plating solutionthus preventing “burning” of the substrate 217. Burning is when thesubstrate 217 after being electroplated has darkened, uneven depositsassociated with high current densities or a lack of metals to be platedor a combination of both. This burning can be prevented by keeping thesubstrate wet with plating solution.

FIG. 24 is a sectional view of another embodiment of the conveyorizedelectroplating device 110 of the present invention having absorptiveapplicator assemblies 116 in the form of strips or block members 285.This embodiment comprises the lower roller assemblies 253, as describedabove, positioned below the substrate 217 and block members 285 made ofabsorptive material being mounted over the holes 148 of the anode 134such that the plating solution that is pumped through the fluid bedassembly 112 will exit the holes 148 in the anode 134 and be deliveredto the substrate. The block members 285 may be made from polyethylene,polypropylene or polyvinyl alcohol or any other material that isflexible and absorbent and chemically compatible. In this embodiment,the block members 285 are in direct contact with the substrate; howeverthe block members 285 may be spaced from the substrate.

FIGS. 25-27 illustrate another embodiment of the conveyorizedelectroplating device 110 of the present invention, wherein drivenabsorptive applicator assemblies 116 engage the bottom of the substrate217 (FIG. 26) and the plating solution is applied from the bottom of thesubstrate 217 through the anode 134. In this embodiment, only one fluidbed assembly 112 and one row of absorptive applicator assemblies 116 areused. The substrate 217 moves over the track 119 defined by theabsorptive applicator assemblies 116. The absorptive applicatorassemblies 116 are positioned above the fluid bed assembly 112. Thefluid bed assembly 112 comprises a manifold 130, several baffles 132 andan anode 134, as described previously. The plating solution is pumpedthrough the fluid bed assembly 112 exiting the anode 134 at the anodeholes 148 and is applied to the absorptive applicator assemblies 116. Ascan be seen in FIG. 26, the absorptive applicator assemblies 116 arespaced from the anode 134; however, the absorptive applicator assemblies116 may also contact the anode 134.

FIGS. 28-30 illustrate another embodiment of the conveyorizedelectroplating device 110 of the present invention, wherein thesubstrate 217 is positioned between two rows of the absorptiveapplicator assemblies 116 and the plating solution is applied to the topand bottom of the substrate 217. This embodiment of the conveyorizedelectroplating device 110 comprises two fluid bed assemblies 112, tworows of absorptive applicator assemblies 116, the upper rollerassemblies 233 and the lower roller assemblies 253, wherein the lowerroller assemblies 253 are driven members and the upper roller assemblies233 are free to rotate. Each fluid bed assembly 112 comprises a manifold130, a plurality baffles 132 and an anode 134, all of which have beendescribed above. The substrate 217 is driven by the lower rollerassemblies 253 and the conveyor device 114 (not shown for claritypurposes). The plating solution is applied to both sides of thesubstrate 217 by the fluid bed assemblies 112. The solution is pumpedout of the holes 148 of the anodes 134 onto the absorptive applicatorassemblies 116, which are in contact with the substrate 217.Alternatively, the plating solution may be pumped through only one ofthe two fluid bed assemblies 112 thus, electroplating only one surfaceof the substrate 217. This embodiment also includes two spray bars 248each having spray nozzles 249 for wetting the substrate 217 with theplating solution prior to engaging the absorptive applicator assemblies116. By soaking the substrate prior to electroplating the substrate, thesubstrate is not susceptible to being depleted of solution during theelectroplating process and thus, having an uneven “burnt” electroplatedsurface as a result. The spray bars 248 have nozzles 249 connectedthereto which spray the plating onto the substrate 217. The spray barsare fluidly connected to the plating solution reservoir 111.

FIGS. 31-33 illustrate yet another embodiment of the conveyorizedelectroplating device 110 of the present invention, wherein thesubstrate 217 is positioned above the driven absorptive applicatorassemblies 116 and the plating solution is supplied through the anode134 positioned above the substrate 217. In this embodiment, theconveyorized electroplating device 110 comprises one fluid bed assembly112 positioned adjacent to the roller assemblies 116. The platingsolution is pumped through the fluid bed assembly 112 exiting the anodeholes 148 onto the roller assemblies 116 which come in contact with thesubstrate 217.

FIGS. 34-37 illustrate yet another embodiment of the conveyorizedelectroplating device of the present invention, wherein the substrate217 is between upper and lower roller assemblies 233 and 253 and theplating solution is supplied through a fluid passageway defined by theupper and lower roller assemblies 233 and 253. In this embodiment of aconveyorized electroplating device 110, the plating solution istransported to the absorptive applicator assemblies 116 through a supplytubing system 300 such that the plating solution enters a fluidpassageway 301 of the absorptive applicator assemblies 116 (FIG. 37) andis dispersed radially with respect to the absorptive applicatorassemblies 116. The anode 302 has a profile that conforms with theabsorptive applicator assemblies 116 such that the anode 302 is incontact with absorptive applicator assemblies 116 or spaced a relativelysmall distance away therefrom. For example, in one embodiment of thepresent invention, the anode 302 can be spaced approximately 0.125inches to 0.25 inches away from the absorptive applicator assemblies.This embodiment eliminates a manifold and baffles. The absorptiveapplicator assemblies 116 form two rows of absorptive applicatorassemblies 116, the upper and lower roller assemblies 233 and 253,wherein the substrate 217 is fed therethrough and the lower rollerassemblies 233 are driven. The tubing system 300 comprises multipletubes 303 that supply plating solution to each of the upper rollerassemblies 233 from a main line 304. Although the plating solution isonly being supplied to the substrate 217 through the upper rollerassemblies 233, the solution may also be supplied to the substrate 217from both the upper and lower roller assemblies 233 and 253.

FIG. 38 and 39 illustrate upper roller assemblies 233 of theconveyorized electroplating device of the present invention shown inFIGS. 34-37. The upper roller assembly 233 is a tubular member defininga fluid passageway 306. One of the multiple tubes 303 is connected tothe fluid passageway 306 such that plating solution can be deliveredfrom the plating solution source (not shown), through the main tube line304, through the multiple tubes 303 and into the fluid passageway 306.The tubular member is made from porous plastic such as polyvinylchlorideor ceramic such that the plating solution entering the fluid passageway306 is dispersed radially through the tubular member to the substrate217.

FIGS. 40 and 41 illustrate another embodiment of an absorptiveapplicator assembly 116 of the conveyorized electroplating device 110 ofthe present invention having bristles 310 protruding from thecircumference thereof and defining a fluid passageway 308 therethroughfor delivering the plating solution to the substrate 217. Thisembodiment of the absorptive applicator assembly 116 comprises a hollowshaft member 309 and a plurality of radially extending brush bristles310. The brush bristles 310 extend around the entire circumference ofthe shaft 308. The brush bristles 310 comprise a U-shaped elongatedchannel member (not shown) within which the bristles extend. The channelmember is crimped such that it is connected to the bristles and theelongated member is then wound around the shaft 308 where the channelmember can be connected thereto by adhesive, clips or other fasteners.The tubes 303 supplying the plating solution are in fluid communicationwith the fluid passageway 308. The plating solution is delivered to thefluid passageway and is dispersed outwardly onto the substrate 217 whichis in contact therewith. The shaft 308 is made from a porous plasticthat allows for the plating solution to be dispersed radially outwardand through the plastic. The bristles 310 then supply the platingsolution to the substrate. The bristles 310 may be made frompolypropylene or any other suitable material.

FIGS. 42 and 43 illustrate yet another embodiment of an absorptiveapplicator assembly 116 of the conveyorized electroplating device 110 ofthe present invention having a flat brush and defining a fluidpassageway 316 therethrough for delivering plating solution. In thisembodiment, the absorptive applicator assemblies 116 each comprise atubular member 314 defining a fluid passageway 316 and a longitudinalslot 318 that extends the length of the tubular member 314. Theabsorptive applicator assemblies 116 further include a plurality ofbrush bristles 320 that extend radially from the tubular member 314 andcover a portion of the circumference of the tubular member 314 thusforming a flat brush. The plating solution is supplied from the multipletubes 303, to the fluid passageway 316 of the tubular member 314 and itis directed to the brush bristles 320 by the slotted portion 318 of thetubular member 314. The bristles 320 engage the substrate 217 and applythe plating solution thereto. It will be appreciated that All of theabsorptive applicator assemblies 116 illustrated in FIGS. 38-43 may bemanufactured without a fluid passageway therein and thus, be adapted tobe used in the embodiments of the present invention illustrated in FIGS.1-33.

Although the present invention has been described in conjunction withpreferred embodiments thereof, it is expected that many modificationsand variations will be developed. This disclosure and the followingclaims are intended to cover all such modifications and variations.

What is claimed is:
 1. A conveyorized electroplating device, comprising:a fluid bed assembly having a manifold and an anode, said manifoldhaving at least one inlet and defining at least one receptacle portion,said anode being a substantially planar member having a plurality ofholes extending therethrough, said anode connected to said manifold suchthat said anode extends across said at least one receptacle portion; aconveyor device adjacent to said fluid bed assembly; and a plurality ofabsorptive applicator assemblies defining a track, said plurality ofabsorptive applicators adjacent to said anode and in fluid communicationwith said fluid bed assembly.
 2. The conveyorized electroplating deviceaccording to claim 1, wherein said fluid bed assembly further comprisesa plurality of baffles, said plurality of baffles are connected to saidmanifold and are received within said at least one receptacle portionsuch that said anode and said manifold contain said plurality ofbaffles.
 3. The conveyorized electroplating device according to claim 2,wherein said anode is parallel to and in contact with said plurality ofabsorptive applicator assemblies.
 4. The conveyorized electroplatingdevice according to claim 2, further comprising a second fluid bedassembly also having a manifold, a plurality of baffles and an anode,said manifold having at least one inlet and defining at least onereceptacle portion, said plurality of baffles connected to and receivedwithin said at least one receptacle portion, said anode being asubstantially planar member having a plurality of holes extendingtherethrough, said anode connected to said manifold, and wherein saidsecond fluid bed assembly and said first fluid bed assembly arepositioned on either side of said plurality of absorptive applicatorassemblies.
 5. The conveyorized electroplating device according to claim4, wherein said anodes of said first and second fluid bed assembliescontact said plurality of absorptive applicator assemblies.
 6. Theconveyorized electroplating device according to claim 3, wherein saidplurality of absorptive applicator assemblies form two parallel rows. 7.The conveyorized electroplating device according to claim 3, whereinsaid plurality of absorptive applicator assemblies each comprise aroller assembly.
 8. The conveyorized electroplating device according toclaim 7, further comprising a plurality of bearing blocks connected tosaid manifold, said plurality of roller assemblies being rotatablyconnected to said at least one bearing block.
 9. The conveyorizedelectroplating device according to claim 3, wherein said plurality ofabsorptive applicator assemblies each comprise a strip portion.
 10. Theconveyorized electroplating device according to claim 3, wherein saidplurality of absorptive applicator assemblies each comprise a blockportion.
 11. The conveyorized electroplating device according to claim3, further comprising an anode assembly dam connected to said anode. 12.The conveyorized electroplating device of claim 3, wherein said conveyordevice comprises: a drive assembly having a frame, an actuator and amotor, wherein said actuator is connected to said frame and said motoris connected to said actuator; and a gripper assembly connected to saidactuator, said gripper assembly having a housing, a member slideablymounted within a cavity defined by said housing, an arm pivotablymounted to said housing forming a passageway, and a seal mountedadjacent to said arm.
 13. The conveyorized electroplating device ofclaim 1, wherein said conveyor device further comprises: a driveassembly having a frame, an actuator and a motor, wherein said actuatoris connected to said frame and said motor is connected to said actuator;and a gripper assembly connected to said actuator, said gripper assemblyhaving an electrically isolated housing, an electrically conductivemember slideably mounted within a cavity defined by said housing, an armpivotably mounted to said housing forming a passageway, and a sealmounted adjacent to said arm.
 14. A conveyorized electroplating device,comprising: a plurality of absorptive applicator assemblies defining atrack, each of said plurality of absorptive applicator assembliesdefining a fluid passageway that is in fluid communication with a fluidsupply, each of said plurality of absorptive applicator assemblieshaving a profile; a conveyor device adjacent to said track; and an anodeadjacent said track, said anode having a profile that conforms to saidprofiles of said plurality of absorptive applicator assemblies.
 15. Theconveyorized electroplating device according to claim 14, wherein saidanode contacts said plurality of absorptive applicator assemblies. 16.The conveyorized electroplating device according to claim 14, whereineach of said plurality of absorptive applicator assemblies compriseporous plastic rollers.
 17. The conveyorized electroplating deviceaccording to claim 16, wherein each of said porous plastic rollers aremade from one of woven polypropylene and polyethylene.
 18. Theconveyorized electroplating device according to claim 14, wherein eachof said plurality of absorptive applicator assemblies comprise a tubularmember having bristles extending radially from said tubular member, saidtubular member defines said fluid passageway.
 19. The conveyorizedelectroplating device according to claim 14, wherein each of saidplurality of absorptive applicator assemblies comprise a tubular memberdefining the fluid passageway in the form of a slot along the length ofsaid tubular member and a length of bristles extending within said slot.20. The conveyorized electroplating device according to claim 14,wherein said conveyor device comprises: a drive assembly having a frame,an actuator and a motor, wherein said actuator is connected to saidframe and said motor is connected to said actuator; and a gripperassembly connected to said actuator, said gripper assembly having ahousing, a member slideably mounted within a cavity defined by saidhousing, an arm pivotably mounted to said housing forming a passageway,and a seal mounted adjacent to said arm.
 21. The conveyorizedelectroplating device according to claim 14, wherein said conveyordevice comprises: a drive assembly having a frame, an actuator and amotor, wherein said actuator is connected to said frame and said motoris connected to said actuator; and a gripper assembly connected to saidactuator, said gripper assembly having an electrically isolated housing,an electrically conductive member slideably mounted within a cavitydefined by said housing, an arm pivotably mounted to said housingforming a passageway, and a seal mounted adjacent to said arm.